Impact of Heat Spreaders on Thermal Performance of III-N-Based Laser Diode
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2015-03-11 |
| Journal | IEEE Transactions on Components Packaging and Manufacturing Technology |
| Authors | Maciej Kuc, MichaÅ Wasiak, Robert Piotr Sarzaa |
| Institutions | Lodz University of Technology |
| Citations | 8 |
Abstract
Section titled āAbstractāThis paper explores the effect on optical output power of modifications to the package assembly of a blue-violet III-N-based p-down edge-emitting ridge-waveguide laser diode grown on bulk GaN crystal. The calculations were carried out using a 3-D self-consistent finite-element model. We focus on thermal analyses of the size and thermal conductivity of the heat spreader (mainly made of natural diamond and chemical vapor deposition diamond) and on the thickness of the solder. The results open the possibility for multiple increases in output power, due to a considerable increase in the power conversion efficiency of the laser diode.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2013 - Thermal management of GaInNAs/GaAs VECSELs
- 1997 - Design of circular heat spreaders on semi-infinite heat sinks in microelectronics device applications [Crossref]