SOLUTIONS FOR DICING RELEASED CMOS –MEMS MULTI-PROJECT WAFER
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2015-08-22 |
| Authors | Snow H. Tseng, Fu-Yuan Xiao, Y.-Z. Juang, Chin-Fon Chiu |
Abstract
Section titled “Abstract”This paper presents two simple but practical methods to dice the CMOS (Complementary metal oxide semiconductor)-MEMS (Micro electromechanical system) Multi-Project Wafer. On this wafer, micromachined microstructures have been fabricated and released. Conventional diamond blade dicing is usually harmful, and easily damages the microstructures. To avoid this problem, the thick photoresist protective coating and laser dicing methods are proposed. Also, to demonstrate the safety and reliability of our methods, a suspended MEMS inductor was fabricated, and its inductance and quality factor were measured. Because of their simplicity and high reliability, these two methods are expected to benefit the CMOS MEMS technologies. In addition, they may be useful in the packaging of system-on-chip.
Tech Support
Section titled “Tech Support”Original Source
Section titled “Original Source”- DOI: None