Ductile Mode Behavior of Silicon During Scribing by Spherical Abrasive Particles
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2016-01-01 |
| Journal | Procedia CIRP |
| Authors | Arkadeep Kumar, A. M. Kovalchenko, Vanessa Pogue, E. A. Pashchenko, Shreyes N. Melkote |
| Institutions | V. Bakul Institute for Superhard Materials, Georgia Institute of Technology |
| Citations | 32 |
Abstract
Section titled āAbstractāReducing surface and subsurface damage in cutting brittle materials using fixed abrasive processes like wire sawing is an important challenge. This paper investigates the effect of size and shape of abrasives on ductile mode cutting of single crystal silicon. Diamond and tungsten carbide abrasives of different shapes (irregular and spherical) deposited on a steel surface are used to scribe silicon and the material removal mode is analyzed. Experiments show that spherical abrasives enhance ductile mode cutting when compared to irregular shapes, yielding a smoother surface and significantly fewer micro-cracks.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
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