Correlating wafer surface to DW saw profile and wire wear
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2016-06-01 |
| Authors | Paul Brooker, Hubert Seigneur, Winston V. Schoenfeld |
| Institutions | University of Central Florida |
| Citations | 1 |
Abstract
Section titled āAbstractāThe surface of diamond-wire sawn wafers is investigated as a function of different wires. The evolution of the pilgrim waves on the wafer surface is correlated with wire movement. Analysis of wafer surfaces indicated that some wires generate lower surface roughness than others, even using the same sawing recipe.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2010 - Diamond wire wafering: Wafer morphology in comparison to slurry sawn wafers
- 2015 - Origin of the Periodic Structures on Silicon Wafers Sawn with Diamond Wire