Skip to content

A Micro-Droplet Etching Approach for Texturization of Diamond Wire Sawn Multi-Crystalline Silicon Wafers

MetadataDetails
Publication Date2017-01-01
JournalEU PVSEC
AuthorsZ. Xin, H. Chen, Longyan Gong, Song Jin, X. Ye
Citations1

Development of diamond wire sawing of multicrystalline silicon solar cell wafers has been inhibited by its incompetence with conventional acidic wet etching texturization process. A novel texturization method based on localized etching by micro-droplet of HF-HNO3-H2O etchant on wafers has been developed. The micro-droplet is generated by controlled condensation of thermal vapor from a HF-HNO3-H2O bath. Micron scale etch-pit type surface textures are made by applying the micro-droplet etching (MDE) process to diamond wire sawn mc-Si wafers. The light reflectivity is reduced to ~18%, and the sawmarks are removed. A few tens of full size DWS mc-Si wafer samples were manually MDE textured, and send to a solar cell fabrication line along with ordinary slurry sawn wafers, without any adjustment of processing parameters for the MDE textured samples. Encouraging I-V characteristics of the MDE textured samples have been obtained. Both Jsc and Voc are found to increase as compared to the reference alkaline textured samples, and up to 0.56% absolute increase of average energy conversion efficiency is obtained.