Simulation and Experimental Research on the Slicing Temperature of the Sapphire with Diamond Wire
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2018-03-07 |
| Journal | International Journal of Computational Methods |
| Authors | Xuerun Huang, Hui Huang, Hua Guo |
| Institutions | Huaqiao University |
| Citations | 14 |
Abstract
Section titled āAbstractāTemperature has an important influence on the sapphire wafer quality sliced using fixed abrasive diamond wire saw. In this paper, temperature field distribution on the wafer outer surface during the slicing of sapphire ingot was computationally and experimentally studied by taking the effect of coolant into account. The simulation temperature field distribution without coolant is in good agreement with the experimental result, and the cutting depth increases, the maximum temperature located at the middle of slicing zone. Coolant had a significant influence on the wafer temperature field distribution and the movement of slicing wire in a narrow kerf affected the coolant supply, which caused a deviation in the temperature distribution obtained by numerical simulation result and experimental measurement.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 1996 - Fundamentals of Heat and Mass Transfer