Enhanced Cooling of Electronic Chips Using Combined Diamond Coating and Microfluidics
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2019-01-24 |
| Journal | Physical Review Applied |
| Authors | Dor Daniel, A. Mosyak, Roza Akhvlediani, A. Hoffman, Gilad Yossifon |
| Institutions | Technion ā Israel Institute of Technology |
| Citations | 15 |
Abstract
Section titled āAbstractāJust find a way to stay cool: The confluence of high-power chip heat dissipation and localized hot spots expose the limitations of current cooling methods in electronics. To overcome these limitations it is essential to rapidly spread the on-chip sites heat generation and dissipate the extracted heat. The authors investigate the impact of the combination of a diamond heat-spreading layer and microfluidic convection on the performance of a model electronic chip with localized heating. It is shown experimentally and numerically that this combination can significantly reduce the maximum chip temperature.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2002 - Diamond Microchannel Heat Sink Designs for High Heat Flux Thermal Control