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Improvement of ZrC/Zr Coating on the Interface Combination and Physical Properties of Diamond-Copper Composites Fabricated by Spark Plasma Sintering

MetadataDetails
Publication Date2019-02-04
JournalMaterials
AuthorsYanpeng Pan, Xinbo He, Shubin Ren, Mao Wu, Xuanhui Qu
InstitutionsUniversity of Science and Technology Beijing
Citations25

In this study, diamond-copper composites were prepared with ZrC/Zr-coated diamond powders by spark plasma sintering. The magnetron sputtering technique was employed to coat the diamond particles with a zirconium layer. After heat treatment, most of the zirconium reacted with the surface of diamond and was transformed into zirconium carbide. The remaining zirconium on the zirconium carbide surface formed the outer layer. Owing to the method used to produce the ZrC/Zr-coated diamond in this study, the maximum thermal conductivity (TC) of 609 WĀ·māˆ’1Ā·Kāˆ’1 was obtained for 60 vol. % diamond-copper composites and the corresponding coefficient of thermal expansion (CTE) reached as low as 6.75 Ɨ 10āˆ’6 Kāˆ’1. The bending strength of 40 vol. % ZrC/Zr-coated diamond-copper composites reached 255.95 MPa. The thermal and mechanical properties of ZrC/Zr-coated diamond-copper composites were substantially superior to those of uncoated diamond particles. Excellent properties can be attributed to the strengthening of the interfacial combination and the decrease in the interfacial thermal resistance due to the improvement associated with the ZrC/Zr coating. Theoretical analysis was also proposed to compare the thermal conductivities and CTE of diamond-copper composites fabricated with these two kinds of diamond powders.

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  6. 2004 - Thermal properties of diamond/copper composite material [Crossref]
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  8. 2014 - Optimization of sintering parameters for diamond-copper composites in conventional sintering and their thermal conductivity [Crossref]
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