Influences of Diamond Material on Heat Dissipation Capabilities of Helical Slow Wave Structures

At a Glance

Metadata	Details
Publication Date	2019-11-11
Journal	IEEE Transactions on Electron Devices
Authors	Yanwen Liu, Hong Tian, Yuxin Lu, Wen-Qi Shi
Institutions	Institute of Electronics, Chinese Academy of Sciences
Citations	8

Abstract

From theoretical calculations, simulations, and emulations, as well as laboratory testing, we evaluated the influences of both diamond and diamond-film-coated support rods, as well as diamond-film-coated helices, on the heat dissipation capabilities of slow wave structures (SWSs). A comparison between the experiment and simulation data shows that the computer simulation results are in good agreement and offer an important reference for the application of diamond in SWSs. An expression for the coefficient of thermal conductivity for the helix material and for the support rod material indicates that the greater their value, the better the heat dissipation capability of the helical SWS. The simulation and emulation analysis results show that when the helix reaches the same temperature, SWSs made of diamond-film-coated support rods and helix are able to consume 20%-60% more heating power than normal SWSs. Similar to a purely diamond support rod, a diamond-film-coated helix and support rod are able to improve the heat dissipation capabilities of SWSs effectively. In experiments, we tested the heat dissipation capabilities of SWSs with their helix surfaces plated with high-performance gold/copper films and BeO/BeN support rods. The experimental results agree well with the ANSYS simulation and emulation results.

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Original Source

DOI: https://doi.org/10.1109/ted.2019.2945969

References

2004 - groundbreaking helix slow-wave structures with diamond heat sinks for power twts [Crossref]
2013 - Influence of diamond on heat dissipation capability of slow-wave structure of helix TWT