硒化锌晶体超精密切削材料去除机理研究
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2021-01-01 |
| Journal | Infrared and Laser Engineering |
| Authors | 耿瑞文 Geng Ruiwen, 谢启明 Xie Qiming, 张万清 Zhang Wanqing, 康杰 Kang Jie, 梁悦青 Liang Yueqing |
Abstract
Section titled “Abstract”ZnSe crystal has been widely used in infrared imaging and laser systems. However, as a typical soft-brittle material, the material removal mechanism in ultra-precision diamond turning process has not been clarified, it is still challenging to obtain nano-smoothed surface. In the study, the effect of tool ranke angle on ductile-brittle transition depth of ZnSe crystal have been investigated through novel plunge-cutting tests. The ductile regime machining model was revealed by comparing the maximum undeformed chip thickness and ductile-brittle transition depth. With the aid of FESEM, white light interferometer, and Raman spectrometer, the effect of feed rate on surface roughness, surface quality, phase transition and subsurface damage were systematically investigated. The surface defects formation mechanism was proposed. Furthermore, the material removal mechanism of ZnSe crystal in ultra-precision diamond turning process have been revealed.