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6CCVD Research

Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2021-05-11
JournalApplied Sciences
AuthorsHanchul Cho, Taekyung Lee, Doyeon Kim, Hyoungjae Kim
InstitutionsKorea Institute of Industrial Technology
Citations7

Abstract

Section titled ā€œAbstractā€

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 Ī¼m even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 1927 - The Theory and Design of Plate Glass Polishing Machines
  2. 2002 - Pad conditioning in chemical mechanical polishing [Crossref]
  3. 2009 - Novel diamond conditioner dressing characteristics of CMP polishing pad [Crossref]
  4. 2004 - A theory of pad conditioning for chemical-mechanical polishing [Crossref]
  5. 2010 - Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography [Crossref]
  6. 2009 - A Material Removal Model for CMP Based on the Contact Mechanics of Pad, Abrasives, and Wafer [Crossref]
  7. 2011 - Effect of CMP conditioner diamond shape on pad topography and oxide wafer performances [Crossref]
  8. 1997 - Stress distribution in chemical mechanical polishing
  9. 1997 - Von Mises Stress in Chemical-Mechanical Polishing Processes [Crossref]

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