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The electric double layer effect and its strong suppression at Li+ solid electrolyte/hydrogenated diamond interfaces

MetadataDetails
Publication Date2021-08-06
JournalCommunications Chemistry
AuthorsTakashi Tsuchiya, Makoto Takayanagi, Kazutaka Mitsuishi, Masataka Imura, Shigenori Ueda
InstitutionsResearch Organization of Information and Systems, National Institute for Materials Science
Citations27
AnalysisFull AI Review Included
  • Core Value Proposition: A novel, quantitative method using hydrogenated diamond (H-diamond) Electric Double Layer Transistors (EDLTs) to characterize the Electric Double Layer (EDL) effect and its suppression in inorganic solid electrolytes.
  • High EDL Performance: The LSZO (Li-Si-Zr-O) solid electrolyte EDLT achieved massive EDL-induced hole density modulation (up to three orders of magnitude) and a high EDL capacitance (up to 14 ”F/cm2), comparable to liquid electrolytes.
  • Mechanism of Suppression: The EDL effect was strongly suppressed (capacitance reduced by three orders of magnitude) when using the LLTO (La-Li-Ti-O) electrolyte, which contains redox-active Ti ions.
  • Redox Neutralization Confirmed: In situ STEM-EELS confirmed that the suppression mechanism is internal charge neutralization within the LLTO layer, driven by the redox reaction of Ti ions (Ti3+ to Ti4+), rather than interruption of Li+ transport.
  • EDL Structure Validation: In situ Hard X-ray Photoelectron Spectroscopy (HAXPES) confirmed the formation of a classic 2-layer EDL structure at the Au/LSZO interface, featuring a steep potential drop (several MV/cm) in a sub-nm Helmholtz layer and a gentler slope in a several-nm diffusion layer.
  • Engineering Impact: The technique allows for quantitative evaluation of EDL charging mechanisms, crucial for optimizing solid electrolyte interfaces in next-generation solid-state ionic devices.
ParameterValueUnitContext
Hole Density Modulation (LSZO)3orders of magnitudeH-diamond channel, 0 to -1 V VG
Maximum Hole Density (LSZO)2.7 x 1013cm-2H-diamond/LSZO interface
EDL Capacitance (LSZO)Up to 14”F/cm2H-diamond/LSZO interface
EDL Capacitance (LLTO/LSZO)8.7nF/cm2H-diamond/LLTO/LSZO interface (Suppressed)
Ionic Conductivity (LSZO)5.7 x 10-9S/cmAt Room Temperature (RT)
Ionic Conductivity (LLTO)8.9 x 10-9S/cmAt Room Temperature (RT)
Activation Energy (Ionic)0.654 (LSZO), 0.687 (LLTO)eVIonic conduction
Activation Energy (Response)0.657eVSwitching response (1/τ)
Switching Response Time< 1msLSZO device, at 340 K
Potential Drop MagnitudeSeveralMV/cmSteep drop in sub-nm Helmholtz layer (HAXPES)
Helmholtz Layer Thickness0.13 to 0.7nmAu/LSZO interface (Simulated)
Diffusion Layer Thickness10 to 20nmAu/LSZO interface (Simulated)
Electrolyte Film Thickness700nmLSZO or LLTO
LLTO Interlayer Thickness5nmLLTO/LSZO device
  1. H-Diamond Channel Fabrication:

    • H-diamond homoepitaxial film (500 nm thick) was deposited on Ib-type High-Pressure High-Temperature (HPHT) diamond (100) single crystal.
    • Deposition utilized Microwave Plasma Chemical Vapor Deposition (MPCVD) at 1213 K.
    • Gas fluxes were fixed at H2 (1000 sccm) and CH4 (0.5 sccm).
  2. Electrode and Contact Deposition:

    • Pd, Ti, and Au thin films (10, 10, 200 nm thick, respectively) were deposited by electron beam evaporation.
    • Pd insertion was used to ensure good ohmic contact to the H-diamond.
  3. Solid Electrolyte Deposition:

    • LSZO (Li-Si-Zr-O) and LLTO (La-Li-Ti-O) films (700 nm thick) were deposited using Pulsed Laser Deposition (PLD).
    • A 193-nm ArF excimer laser was used for efficient ablation of the wide bandgap materials.
  4. Electrical and Transport Characterization:

    • Electrical characteristics were measured using a semiconductor parameter analyzer and Hall measurement setup (delta mode, ±200 nA current pulses).
    • Ionic conductivities and device response were measured using AC impedance spectroscopy (1 MHz to 0.1 Hz).
  5. In Situ Interface Analysis:

    • STEM-EELS: Used to investigate EDL suppression mechanism by observing Li-K and Ti-L edges near the diamond/LLTO interface under applied DC voltage (0 V and 1 V).
    • HAXPES: Used to assess the potential drop profile at the Au electrode/LSZO interface under applied DC voltage (0 V to 1 V), confirming the Helmholtz and diffusion layer structure.
  • All-Solid-State Lithium Ion Batteries (ASS-LIBs): The method provides a critical tool for evaluating and optimizing the interfacial resistance and charge transfer kinetics at the solid electrolyte/electrode interface, a major bottleneck in ASS-LIB performance.
  • Memristors and Atomic Switches: Relevant for characterizing the EDL effect in solid-state ionic thin films used in Electrochemical Metallization (ECM) devices, which rely on precise ion migration and charge accumulation for switching.
  • Neuromorphic Devices: Applicable to solid-state ionic devices designed for analog computation and neural network functions, where EDL dynamics control switching properties and plasticity.
  • Advanced Nanoelectronics (ICT): Used for developing high-performance EDLTs for physical property tuning (e.g., magnetization, bandgap) and high-density charge accumulation.
  • Sensor Technology: Relevant for developing highly sensitive ion sensors based on electrolyte-gated FETs, leveraging the large capacitance achieved by the EDL effect.