The electric double layer effect and its strong suppression at Li+ solid electrolyte/hydrogenated diamond interfaces
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2021-08-06 |
| Journal | Communications Chemistry |
| Authors | Takashi Tsuchiya, Makoto Takayanagi, Kazutaka Mitsuishi, Masataka Imura, Shigenori Ueda |
| Institutions | Research Organization of Information and Systems, National Institute for Materials Science |
| Citations | 27 |
| Analysis | Full AI Review Included |
Executive Summary
Section titled âExecutive Summaryâ- Core Value Proposition: A novel, quantitative method using hydrogenated diamond (H-diamond) Electric Double Layer Transistors (EDLTs) to characterize the Electric Double Layer (EDL) effect and its suppression in inorganic solid electrolytes.
- High EDL Performance: The LSZO (Li-Si-Zr-O) solid electrolyte EDLT achieved massive EDL-induced hole density modulation (up to three orders of magnitude) and a high EDL capacitance (up to 14 ”F/cm2), comparable to liquid electrolytes.
- Mechanism of Suppression: The EDL effect was strongly suppressed (capacitance reduced by three orders of magnitude) when using the LLTO (La-Li-Ti-O) electrolyte, which contains redox-active Ti ions.
- Redox Neutralization Confirmed: In situ STEM-EELS confirmed that the suppression mechanism is internal charge neutralization within the LLTO layer, driven by the redox reaction of Ti ions (Ti3+ to Ti4+), rather than interruption of Li+ transport.
- EDL Structure Validation: In situ Hard X-ray Photoelectron Spectroscopy (HAXPES) confirmed the formation of a classic 2-layer EDL structure at the Au/LSZO interface, featuring a steep potential drop (several MV/cm) in a sub-nm Helmholtz layer and a gentler slope in a several-nm diffusion layer.
- Engineering Impact: The technique allows for quantitative evaluation of EDL charging mechanisms, crucial for optimizing solid electrolyte interfaces in next-generation solid-state ionic devices.
Technical Specifications
Section titled âTechnical Specificationsâ| Parameter | Value | Unit | Context |
|---|---|---|---|
| Hole Density Modulation (LSZO) | 3 | orders of magnitude | H-diamond channel, 0 to -1 V VG |
| Maximum Hole Density (LSZO) | 2.7 x 1013 | cm-2 | H-diamond/LSZO interface |
| EDL Capacitance (LSZO) | Up to 14 | ”F/cm2 | H-diamond/LSZO interface |
| EDL Capacitance (LLTO/LSZO) | 8.7 | nF/cm2 | H-diamond/LLTO/LSZO interface (Suppressed) |
| Ionic Conductivity (LSZO) | 5.7 x 10-9 | S/cm | At Room Temperature (RT) |
| Ionic Conductivity (LLTO) | 8.9 x 10-9 | S/cm | At Room Temperature (RT) |
| Activation Energy (Ionic) | 0.654 (LSZO), 0.687 (LLTO) | eV | Ionic conduction |
| Activation Energy (Response) | 0.657 | eV | Switching response (1/Ï) |
| Switching Response Time | < 1 | ms | LSZO device, at 340 K |
| Potential Drop Magnitude | Several | MV/cm | Steep drop in sub-nm Helmholtz layer (HAXPES) |
| Helmholtz Layer Thickness | 0.13 to 0.7 | nm | Au/LSZO interface (Simulated) |
| Diffusion Layer Thickness | 10 to 20 | nm | Au/LSZO interface (Simulated) |
| Electrolyte Film Thickness | 700 | nm | LSZO or LLTO |
| LLTO Interlayer Thickness | 5 | nm | LLTO/LSZO device |
Key Methodologies
Section titled âKey Methodologiesâ-
H-Diamond Channel Fabrication:
- H-diamond homoepitaxial film (500 nm thick) was deposited on Ib-type High-Pressure High-Temperature (HPHT) diamond (100) single crystal.
- Deposition utilized Microwave Plasma Chemical Vapor Deposition (MPCVD) at 1213 K.
- Gas fluxes were fixed at H2 (1000 sccm) and CH4 (0.5 sccm).
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Electrode and Contact Deposition:
- Pd, Ti, and Au thin films (10, 10, 200 nm thick, respectively) were deposited by electron beam evaporation.
- Pd insertion was used to ensure good ohmic contact to the H-diamond.
-
Solid Electrolyte Deposition:
- LSZO (Li-Si-Zr-O) and LLTO (La-Li-Ti-O) films (700 nm thick) were deposited using Pulsed Laser Deposition (PLD).
- A 193-nm ArF excimer laser was used for efficient ablation of the wide bandgap materials.
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Electrical and Transport Characterization:
- Electrical characteristics were measured using a semiconductor parameter analyzer and Hall measurement setup (delta mode, ±200 nA current pulses).
- Ionic conductivities and device response were measured using AC impedance spectroscopy (1 MHz to 0.1 Hz).
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In Situ Interface Analysis:
- STEM-EELS: Used to investigate EDL suppression mechanism by observing Li-K and Ti-L edges near the diamond/LLTO interface under applied DC voltage (0 V and 1 V).
- HAXPES: Used to assess the potential drop profile at the Au electrode/LSZO interface under applied DC voltage (0 V to 1 V), confirming the Helmholtz and diffusion layer structure.
Commercial Applications
Section titled âCommercial Applicationsâ- All-Solid-State Lithium Ion Batteries (ASS-LIBs): The method provides a critical tool for evaluating and optimizing the interfacial resistance and charge transfer kinetics at the solid electrolyte/electrode interface, a major bottleneck in ASS-LIB performance.
- Memristors and Atomic Switches: Relevant for characterizing the EDL effect in solid-state ionic thin films used in Electrochemical Metallization (ECM) devices, which rely on precise ion migration and charge accumulation for switching.
- Neuromorphic Devices: Applicable to solid-state ionic devices designed for analog computation and neural network functions, where EDL dynamics control switching properties and plasticity.
- Advanced Nanoelectronics (ICT): Used for developing high-performance EDLTs for physical property tuning (e.g., magnetization, bandgap) and high-density charge accumulation.
- Sensor Technology: Relevant for developing highly sensitive ion sensors based on electrolyte-gated FETs, leveraging the large capacitance achieved by the EDL effect.