Experimental study on rolling and brittle fracture to single crystal silicon and sapphire by diamond cutter wheel
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2022-01-01 |
| Journal | Optics and Precision Engineering |
| Authors | Rong Chen, Cong Zhou, Jin Xie, Zhaojie CHEN |
| Institutions | Dongguan University of Technology, South China University of Technology |
| Citations | 1 |
Abstract
Section titled “Abstract”Abstract：Rapid partitioning of integrated circuit chips is a key process in semiconductor device manufac• turing.Usually，a fixed single-point diamond tool blade is used for scribing and cutting.However，the process can result in irregular cracks and damage chip circuits.Therefore，for two chip materials，i.e. ， single crystal silicon and sapphire，a 2. 5 mm diameter diamond cutter wheel was used for rolling brittle fracture processing experiments.We analyzed the stress distribution under different machining processes and discussed the effects of the cutter wheel geometry and process parameters on crack extension and the rolling brittle fracture quality of different materials.The results show that the concentrated tension stress