Microscopic Evaluation of Al<sub>2</sub>O<sub>3</sub>/p-Type Diamond (111) Interfaces Using Scanning Nonlinear Dielectric Microscopy
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2022-05-31 |
| Journal | Materials science forum |
| Authors | Yu Ogata, Kohei Yamasue, Xufang Zhang, Tsubasa Matsumoto, Norio Tokuda |
| Institutions | Tohoku University, Kanazawa University |
| Citations | 3 |
| Analysis | Full AI Review Included |
Microscopic Evaluation of Al2O3/p-Type Diamond (111) Interfaces Using Scanning Nonlinear Dielectric Microscopy
Section titled âMicroscopic Evaluation of Al2O3/p-Type Diamond (111) Interfaces Using Scanning Nonlinear Dielectric MicroscopyâExecutive Summary
Section titled âExecutive Summaryâ- Core Problem Addressed: Low channel mobility in diamond inversion channel MOSFETs, primarily attributed to high interface defect density (Dit) at the Al2O3/diamond (111) interface.
- Methodology: Scanning Nonlinear Dielectric Microscopy (SNDM) was employed, utilizing conventional dC/dV imaging, local Capacitance-Voltage (CV) profiling, and time-resolved local Deep Level Transient Spectroscopy (DLTS) for nanoscale analysis.
- Dit Ranking by Termination: Local CV profiling established a clear ranking of interface quality: Dit was lowest for Al2O3/H-diamond (111), followed by Al2O3/OH-diamond, and highest for Al2O3/O-diamond.
- Spatial Non-Uniformity: Significant non-uniform spatial fluctuations in interface properties (dC/dV maps) were observed across all samples, particularly the Al2O3/OH-diamond interface.
- Impact of Surface Flatness: The flatness of the diamond surface strongly affects Dit distribution: atomically flat regions showed line-shaped Dit features (potentially related to atomic steps), while rough areas exhibited clustered high Dit regions.
- Conclusion: The flattening process of the diamond surface is crucial for controlling the distribution and size of interface defects, which is necessary for improving MOSFET performance.
Technical Specifications
Section titled âTechnical Specificationsâ| Parameter | Value | Unit | Context |
|---|---|---|---|
| Insulating Layer Material | Al2O3 | N/A | Dielectric formed by ALD |
| Insulating Layer Thickness | 50 | nm | ALD Al2O3 thickness |
| Substrate Material/Orientation | p-type diamond | (111) | HPHT synthesized |
| Substrate Boron Concentration | 1017 | cm-3 | p-type doping level |
| Ohmic Contact Layer Thickness | 200 | nm | High B concentration p+ CVD diamond |
| Gold Electrode Thickness | 200 | nm | Vacuum deposited layer |
| SNDM Tip Radius | 2 | ”m | Pt-Ir coated conductive cantilever |
| H-diamond Max CV Slope | 68 | aF/V | Measured at -24 V (indicates lowest Dit) |
| OH-diamond Max CV Slope | 51 | aF/V | Measured at 21 V (intermediate Dit) |
| O-diamond Max CV Slope | 10 | aF/V | Measured at 11 V (indicates highest Dit) |
| Local DLTS Dit Average | 1013 | cm-2eV-1 | Order of magnitude for Al2O3/OH-diamond |
| Local CV Pulse Amplitude (H-diamond) | 55 | Vpp | Triangular voltage pulse amplitude |
| Local CV Pulse Amplitude (O/OH-diamond) | 70 | Vpp | Triangular voltage pulse amplitude |
| Local CV Sweep Rate | Tens of | kHz | High-frequency measurement regime |
| Local DLTS Accumulation Pulse | 5 | ”s | Rectangular voltage pulse length |
Key Methodologies
Section titled âKey Methodologiesâ- Substrate Synthesis and Doping: High-pressure high-temperature (HTHP) synthesized p-type diamond (111) substrates were used, featuring a boron concentration of 1017 cm-3. A highly doped p+ CVD diamond layer (200 nm) was included for ohmic contact formation.
- Surface Flattening: Anisotropic diamond etching was performed based on a carbon solid solution reaction into Ni. This process was chosen over conventional plasma etching to achieve atomically flat regions and minimize plasma-induced damage.
- Surface Termination: Three distinct interface termination processes were applied to the diamond surface prior to dielectric deposition: Hydrogen (H), Oxygen (O), and Hydroxyl (OH) termination.
- Dielectric Deposition: A 50 nm Al2O3 insulating layer was deposited using Atomic Layer Deposition (ALD).
- Conventional SNDM (dC/dV Imaging): A small sinusoidal voltage was applied to the sample, and a lock-in amplifier was used to obtain the voltage derivative of capacitance (dC/dV), mapping spatial fluctuations of interface properties.
- Time-Resolved SNDM (Local CV Profiling): Large amplitude triangular voltage pulses (up to 70 Vpp) were applied at high sweep rates (tens of kHz). The resulting capacitance responses were averaged (1000 times) across a 5 ”m x 5 ”m area to generate local CV profiles.
- Time-Resolved SNDM (Local DLTS): A 5 ”s rectangular accumulation voltage pulse was applied, stepping down from a reference level (-5 V) to a target level (+5 V). The resulting transient capacitance responses were averaged (1000 times) to map the microscopic distribution of Dit in 1 ”m x 1 ”m areas.
Commercial Applications
Section titled âCommercial Applicationsâ- High-Performance Power MOSFETs: The primary application is the realization of inversion channel p-type diamond MOSFETs with improved channel mobility, crucial for achieving high power, high breakdown voltage, and normally-off operation.
- High-Frequency Devices: Diamondâs inherent high carrier mobility and high thermal conductivity make these devices suitable for high-speed and high-frequency power switching applications.
- Gate Stack Optimization: The findings provide actionable data for optimizing the gate dielectric/semiconductor interface (Al2O3/Diamond). Controlling the surface termination (H vs. OH vs. O) and ensuring surface flatness are key engineering steps to reduce Dit and enhance device efficiency.
- Thermal Management Solutions: Diamondâs superior thermal properties are leveraged in power devices where heat dissipation is a major constraint, enabling operation at higher current densities and temperatures.
- 6ccvd.com Relevance: This research focuses on overcoming fundamental material limitations (interface defects) in diamond semiconductors, directly supporting the development and commercialization of high-quality CVD diamond substrates and advanced electronic devices.
View Original Abstract
Improvement of channel mobility is required to improve the performance of the inversion channel MOSFETs using diamond. The previous studies have suggested that high interface defect density ( D it ) at the Al 2 O 3 /diamond (111) interface has a significant impact on the carrier transport property on a channel region. To investigate the physical origins of the high D it , especially from microscopic point of view, here we investigate Al 2 O 3 /p-type diamond (111) interfaces using scanning nonlinear dielectric microscopy (SNDM). We find the high spatial fluctuations of Al 2 O 3 /hydroxyl (OH)-terminated diamond (111) interface properties and their difference by the flatness of the diamond surface.
Tech Support
Section titled âTech SupportâOriginal Source
Section titled âOriginal SourceâReferences
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