PROCESS USED IN MANUFACTURING HEAT SENSORS DEVELOPMENT OF TRANSMISSION TECHNOLOGY.
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2022-10-10 |
| Journal | THE ROLE OF STANDARDIZATION IN MANUFACTURING |
| Authors | Faxriddin Isroilov, Orif Qosimov |
Abstract
Section titled āAbstractāCutting monocrystalline silicon ingots into wafers is done by one of the following methods: cutting with discs with an outer or inner edge containing diamonds; cutting with steel blades or abrasive suspension wire; cutting by abrasive Ā¬ultrasonic processing; electroerosive cutting; electron or laser cutting. Each of these methods differs from each other in terms of productivity, depth of the mechanically damaged layer, the output of useful material, the possibility of collecting and restoring the semiconductor material, and the possibility of obtaining crystals of different shapes