Study on radar electronic module cooling by using diamond/copper composites
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2023-12-02 |
| Journal | Functional Diamond |
| Authors | Jinwang Li, Tianshu Cong, Shugang Dai |
| Institutions | Nanjing University of Aeronautics and Astronautics, China Shipbuilding Industry Corporation (China) |
| Citations | 5 |
Abstract
Section titled âAbstractâDiamond/copper composites are regarded as a new generation of heat dissipation materials because of their good thermal conductivity and matched thermal expansion coefficient to semiconductor materials. This study focuses on the thermal application study of the diamond/copper composite. A diamond/copper composite cooling module was designed to meet the requirements of thermal physical properties of an electronic device. The heat conduction resistance of diamond/copper substrate was calculated theoretically. It is found that the optimum thickness of diamond/copper substrate is about 0.34 times of the equivalent radius and improving the thermal conductivity of the substrate is more effective for heat dissipation when the thermal convective resistance is low. When the heat flux of the chip is 100 W/cm2, the temperature of the chip using diamond/copper composite as substrate is 4.84 °C lower than that using silicon aluminum alloy. The improvement effect increases about 5 °C when the heat flux increases by 100 W/cm2.
Tech Support
Section titled âTech SupportâOriginal Source
Section titled âOriginal SourceâReferences
Section titled âReferencesâ- 2016 - Recent progress on interface and thermal conduction models of diamond/copper composites used as electronic packaging material[J]
- 2013 - Research status and prospect of CD/Cu composite for electronic packaging material[J]
- 2019 - Research progress on preparation Âmethods of high thermal conductivity diamond/copper composites[J]