Interfacial structures and their effect on thermal conductivity and mechanical properties of diamond/Cu−B composites
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2024-01-01 |
| Journal | Transactions of Nonferrous Metals Society of China |
| Authors | Zhongnan Xie, Hong Guo, Wei Xiao, Ximin Zhang, Shuhui Huang |
| Institutions | State Key Laboratory of Nonferrous Metals and Processes, General Research Institute for Nonferrous Metals (China) |
| Citations | 6 |
Abstract
Section titled “Abstract”Different interfacial structures of diamond/Cu composites were synthesized by varying the boron (B) content. The microstructural, thermal, and mechanical properties of the composites were investigated. The results showed that diamond/Cu−B composites had a high thermal conductivity of 695 W/(m·K) and high bending strength of 535 MPa attributed to the formation of a micron-scale dentate B4C interface structure. The dentate B4C provided dual functions of metallurgical bonding and mechanical meshing for interface bonding. A semi-coherent interface was formed between the diamond and B4C, where the diamond(111) and B4C(104) planes were parallel. The micro/nano-scale dentate structure improved the phonon transmission efficiency and bonding strength at the interface.
Tech Support
Section titled “Tech Support”Original Source
Section titled “Original Source”References
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