Direct Deposition of Carbon Films on Tungsten Substrates Using Coaxial Arc Plasma Deposition for Electrochemical Electrode Applications
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2024-05-26 |
| Journal | IEEJ Transactions on Electrical and Electronic Engineering |
| Authors | Takeshi Hara, Hiroaki Moriya, Masumi Ogishima, Satoki Nagano, Tsuyoshi Yoshitake |
| Institutions | Hokuriku Electric Power Company (Japan), Kyushu University |
Abstract
Section titled āAbstractāCarbon films were directly formed on tungsten (W) substrates without an intermediate layer via coaxial arc plasma deposition. The substrate surface was pretreated to remove the native oxide films to improve film adhesion using environmentally friendly alkaline and acidic solutions. The fundamental electrochemical characteristics of the deposited films were similar to those of diamond and diamondālike carbon films. Thus, the deposited films can be used in the electrodes of highly sensitive electrochemical sensors. Ā© 2024 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2020 - Improving high temperature tribological performances of Si doped diamondālike carbon by using W interlayer