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Self-aligned gate electrode for hydrogen-terminated diamond field-effect transistors with a hexagonal boron nitride gate insulator

MetadataDetails
Publication Date2024-08-26
JournalApplied Physics Letters
AuthorsYosuke Sasama, Takuya Iwasaki, Mohammad Monish, Kenji Watanabe, Takashi Taniguchi
InstitutionsNational Institute for Materials Science, University of Tsukuba
Citations3

Diamond electronic devices have attracted significant interest owing to their excellent semiconducting properties. We recently demonstrated that eliminating surface-transfer doping enhances carrier mobility and achieves normally off behavior in diamond field-effect transistors (FETs) with a hexagonal boron nitride (h-BN) gate insulator. In our previous study, the gate electrode was overlapped onto the source/drain electrodes to prevent the increase in access resistance caused by excluding surface-transfer doping. However, it is known that gate overlap increases parasitic capacitance and gate leakage current. In this study, we developed a technique for self-aligning the gate electrode with the edge of h-BN using oblique-angle deposition. The diamond FET with a self-aligned gate electrode exhibits optimal FET characteristics, including high mobility of ā‰ˆ 400 cm2Vāˆ’1sāˆ’1, low sheet resistance of 2.4 kĪ©, and output characteristics demonstrating pinch-off behavior. Furthermore, the capacitance-voltage characteristics clearly indicate distinct ON and OFF states, validating the efficacy of this technique. This method enables the fabrication of diamond/h-BN FETs with no gate overlap and without increasing access resistance, making it a promising approach for developing high-speed, low-loss diamond FETs with a wide range of applications.

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