Effect of Hot-forging Temperature on the Microstructure and Thermal Conductivity of Copper/W-coated Diamond Composites
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2025-03-14 |
| Journal | Journal of the Japan Society of Powder and Powder Metallurgy |
| Authors | Jingnan Ma, Rob Torrens, L. Bolzoni, Fei Yang |
| Institutions | University of Waikato |
| Analysis | Full AI Review Included |
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Executive Summary
Section titled âExecutive Summaryâ- The study investigates the impact of hot-forging temperature on the microstructure and thermal conductivity (TC) of copper/W-coated diamond composites for thermal management applications.
- Copper/55vol%W-coated diamond composites were fabricated via hot forging at 800 °C, 950 °C, and 1050 °C.
- Annealing of W-coated diamond particles was performed to understand tungsten carbide interface formation.
- The optimal hot-forging temperature was found to be 950 °C, resulting in a composite with a TC of 432 W/mK.
- The 950 °C composite exhibited an interface primarily composed of WC phase with a minor W2C phase.
- The study provides insights into controlling the tungsten carbide interface formation by varying the hot-forging temperature.
- The research emphasizes the potential of W coating in copper/diamond composites for advanced thermal management in high-power electronic devices.
Technical Specifications
Section titled âTechnical Specificationsâ| Parameter | Value | Unit | Context the best thermal conductivity is 432 W/mK | Diamond Particle Size | ~70 | Âľm | Used relatively small diamond particles. THE BEST THERMAL CONDUCTIVITY IS 432 W/mK | W Coating Thickness | 50 | nm | On MBD8 diamond particles.