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System-level design of a thermally stable, highly robust MEMS tuning fork gyroscope with enhanced sensitivity for wearable and robotic applications

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2025-08-01
JournalAIP Advances
AuthorsFaraz Javaid, Amir Hamza, Mohsin Islam Tiwana, Muhammad Osama Ali, Uzair Bashir
InstitutionsNational Court Reporters Association, University of the Sciences

Abstract

Section titled ā€œAbstractā€

This paper presents the system-level design and analysis of a 39.08 kHz, split mode, thermally stable, microelectromechanical systems (MEMS) tuning fork gyroscope (TFG) with enhanced sensitivity, exhibiting high robustness along drive and sense axes against vibrations and shocks. The gyroscope is designed on a commercially available wafer-level vacuum-packaged MEMS integrated design for inertial sensors (MIDIS) process by Teledyne DALSA Semiconductor Inc. The TFG has a novel lever type drive and diamond shaped sense mechanisms to enhance robustness along both axes. Enhanced sensitivity is achieved by implementing a large drive displacement and sense mode electrical tuning mechanism along with a highly optimized decoupling mechanism. Quadrature error is reduced electronically by strategically placed error correction plates. Additionally, drive sense combs are used for scale factor correction. System-level working of TFG with integrated readout microelectronics is verified through the finite element method (FEM) and transient simulation based analysis using CoventorWare and Simulink software. The simulation results indicate vibration resistance with a maximum displacement of 14.89 Ī¼m and 1.37 Ī¼m for 1000 g and shock resistance with a maximum displacement of 14.95 Ī¼m and 1.38 Ī¼m for 25 Ī¼s, 1000 g shock signal in drive and sense directions, respectively, without structural damage. The system achieves an output bias thermal stability of 0.067 Ī¼V/Ā°C. Moreover, the system achieves an improved capacitive and voltage sensitivity of 20.75 fF/(Ā°/s) and 9.34 mV/(Ā°/s), respectively. The results achieved make the proposed MEMS TFG useful in distributed sensors, micro-robots, wearable electronics, and high-end applications.

Tech Support

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Original Source

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References

Section titled ā€œReferencesā€
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  3. 2017 - Design and analysis of wafer-level vacuum-encapsulated disk resonator gyroscope using a commercial MEMS process
  4. 2017 - Wafer-level vacuum-encapsulated rate gyroscope with high quality factor in a commercial MEMS process [Crossref]
  5. 2009 - A sub-0.2Ā°/hr bias drift micromechanical silicon gyroscope with automatic CMOS mode-matching [Crossref]
  6. 2017 - MEMS gyroscope with less than 1-deg/h bias instability variation in temperature range from āˆ’40Ā°C to 125Ā°C [Crossref]
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  8. 2023 - Searching for the origin of zero-rate offset and scale-factor drift in NEMS-based Nav-grade gyroscope
  9. 2022 - Thermal characterization of scale-factor and zero-rate offset in near-navigation-grade nems-based gyroscopes
  10. 2020 - 0.0062 ā—¦/hr āˆšangle random walk and 0.027 ā—¦/hr bias instability from a micro-shell resonator gyroscope with surface electrodes

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