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Study on diamond/aluminum composites packaging material applied to microwave power components

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2025-09-01
JournalJournal of Physics Conference Series
AuthorsJian Peng, Jiyu Qian, Tao Wei, Jingwei Wu

Abstract

Section titled ā€œAbstractā€

Abstract With the development of high-power electronic equipment, the heat flux of microwave power components increases sharply, becoming one of the bottlenecks restricting the development of high-power electronic equipment. The selection of packaging materials for high thermal conductivity is a key to solving the heat dissipation problem of microwave power components with high heat flux. This paper investigates the application of a diamond/aluminum composite packaging material in microwave power components through a combined approach of experimental testing and numerical simulation. Experimental results show that a novel microwave power component designed with diamond/aluminum packaging material has an advantage in heat dissipation over the current silicon/aluminum packaging component. Under the heat condition of 10-50 W per chip, the temperature difference between the chip and the coolant is reduced by 22.2%-24.4%, and the enhancement in the heat transfer capability is unrelated to the substrate area when the substrate area far exceeds the heat source area. Based on thermal simulation results, the thickness of the diamond/aluminum packaging substrate has a significant impact on component heat dissipation. For each chip with heat dissipation ranging from 10 to 50 W, the optimized thickness of the diamond/aluminum packaging substrate is 2.1 mm.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2023 - Advancements in SiC-reinforced metal matrix composites for high-performance electronic packaging: A review of thermo-mechanical properties and future trends [Crossref]
  2. 2024 - Aluminium-Silicon Lightweight Thermal Management Alloys with Controlled Thermal Expansion [Crossref]
  3. 2022 - Enhanced thermal conductivity and long-term stability of diamond/aluminum composites using SiC-coated diamond particles [Crossref]
  4. 2003 - The influence of artificial diamond additions on the formation and properties of an electroplated copper metal matrix coating [Crossref]
  5. 2006 - Selective interfacial bonding in Al (Si)-diamond composites and its effect on the thermal conductivity [Crossref]
  6. 2005 - Interface formation in infiltrated Al (Si)/diamond composites
  7. 2023 - Study on radar electronic module cooling by using diamond/copper composites

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