Influence of wire bowing during diamond wire sawing on the surface roughness of crystal wafers
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2025-10-23 |
| Journal | Engineering Research Express |
| Authors | Zhishu Lin, Jiacheng Yu, Shengbo Eben Li |
Abstract
Section titled āAbstractāAbstract Diamond wire sawing has become a primary slicing method for certain hard and brittle materials due to its advantages of minimal material loss and high cutting efficiency. However, during the sawing process, the bowing of the wire caused by the deformation of the wire can adversely affect machining quality. Excessive wire bowing may even lead to wire breakage, resulting in scrapped slices. In this study, a single-wire saw machine was used to slice crystal workpieces under various conditions, including different tension forces, feed rates, and wire speeds. A high-speed camera was employed to capture the wire bowing for each set of processing parameters, while the surface roughness of the resulting crystal wafers was systematically measured. The experimental results showed that increasing the tension force reduced the wire bowing, with little to no impact on the surface roughness. In contrast, an increased feed rate significantly raised both the wire bowing and the surface roughness. As the wire speed increased, the wire bowing gradually decreased in a nearly linear fashion, while the surface roughness was notably reduced. Overall, as the material removal rate increased, both the wire bowing and the surface roughness increased accordingly. A nearly linear relationship was observed between the wire bowing and the surface roughness. Specifically, when the maximum wire bowing increased from 0.264 mm to 1.064 mm, the surface roughness (Sa) of the crystal wafers increased from 0.89 Ī¼m to 1.43 Ī¼m.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
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