Thermal Properties of Diamond Aligned Electroless Ni Plating Layer/Oxygen Free Cu Substrates
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2015-04-28 |
| Journal | Journal of Korean Powder Metallurgy Institute |
| Authors | Dawoon Jeong, Song‐Yi Kim, Kyoung‐Tae Park, Seok‐Jun Seo, Taek Soo Kim |
Abstract
Section titled “Abstract”Abstract The monolayer engineering diamond particles are aligned on the oxygen free Cu plates with electroless Niplating layer. The mean diamond particle sizes of 15, 23 and 50 µm are used as thermal conductivity pathway for fab-ricating metal/carbon multi-layer composite material systems. Interconnected void structure of irregular shaped diamondparticles allow dense electroless Ni plating layer on Cu plate and fixing them with 37-43% Ni thickness of their meandiameter. The thermal conductivity decrease with increasing measurement temperature up to 150 o C in all diamond sizeconditions. When the diamond particle size is increased from 15 µm to 50 µm (Max. 304 W/mK at room temperature)tended to increase thermal conductivity, because the volume fraction of diamond is increased inside plating layer. Keywords: Thermal conductivity, Diamond, Multi-layer materials, Electroless plating ······························································································································· ·································································································