Skip to content
6CCVD Research

High-Power LED Chip-on-Board Packages With Diamond-Like Carbon Heat-Spreading Layers

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2015-10-16
JournalJournal of Display Technology
AuthorsPai-Yang Tsai, Hou-Kuei Huang, Chien-Min Sung, Ming-Chi Kan, Yeong-Her Wang
Citations9

Abstract

Section titled ā€œAbstractā€

The thermal properties of a flip-chip light-emitting diode (FCLED) chip-on-board (COB) with diamond-like carbon (DLC) heat-spreading layers are investigated. The temperature-dependent performance of the COB packages with and without DLC heat-spreading layers at the LED and metal core printed circuit board sites are studied. Results show that the device junction temperature and thermal conductivity of the COB package with DLC heat-spreading layers (DLC package) are less than those of the COB package without DLC heat-spreading layers (regular package). For the steady state of light intensity, the mean of light intensity drop for 12 tested packages of DLC package was improved by 6.1% after 3 hours of burn-in compared with that of the regular package.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2006 - Cold cathode fluorescence light with amorphous diamond coated electrodes

Reads Similar to This

Cubic BeB2 - A metastable p-type conductive material from first principles Plasmon resonance enhanced temperature-dependent photoluminescence of Si-V centers in diamond Manufacturing of cylindrical-shaped CVD-SiC Mold Material for High-resolution Glass Lens