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6CCVD Research

Cu/Diamond composite heat-conducting shims

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2015-11-02
JournalJournal of Physics Conference Series
AuthorsE.N. Galashov, A A Yusuf, E M Mandrik
InstitutionsNovosibirsk State University

Abstract

Section titled ā€œAbstractā€

Composite material with high thermal conductivity was obtained by the method of thermal sintering of a diamond (50 - 75%) with a size of 20 to 250 Ī¼m in a matrix of copper.Coefficient of thermal conductivity of copper diamond composite materials was measured and is 450 - 650 WĀ·m-1Ā·K-1. The coefficient of thermal expansion CTE was measured and is 5.5 - 7.5 Ā· 10-6/Ā°C. The obtained copper diamond composite materials are promising objects for use in THz and microwave devices.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

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