Effect of grain size of polycrystalline diamond on its heat spreading properties
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2016-05-09 |
| Journal | Applied Physics Express |
| Authors | Roland B. Simon, J. Anaya, Firooz Faili, Richard Balmer, G. T. Williams |
| Institutions | University of Bristol, Element Six (United States) |
| Citations | 54 |
Abstract
Section titled āAbstractāAbstract The exceptionally high thermal conductivity of polycrystalline diamond (>2000 W m ā1 K ā1 ) makes it a very attractive material for optimizing the thermal management of high-power devices. In this paper, the thermal conductivity of a diamond sample capturing grain size evolution from nucleation towards the growth surface is studied using an optimized 3Ļ technique. The thermal conductivity is found to decrease with decreasing grain size, which is in good agreement with theory. These results clearly reveal the minimum film thickness and polishing thickness from nucleation needed to achieve single-crystal diamond performance, and thus enable production of an optimal polycrystalline diamond for heat-spreading applications.