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6CCVD Research

Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2017-07-02
JournalMaterials
AuthorsMuhammad Zain-ul-abdein, Hassan Ijaz, Waqas Saleem, Kabeer Raza, Abdullah S. Bin Mahfouz
InstitutionsTunis El Manar University, University of Jeddah
Citations12

Abstract

Section titled ā€œAbstractā€

Copper/diamond (Cu/D) composites are famous in thermal management applications for their high thermal conductivity values. They, however, offer some interface related problems like high thermal boundary resistance and excessive debonding. This paper investigates interfacial debonding in Cu/D composites subjected to steady-state and transient thermal cyclic loading. A micro-scale finite element (FE) model was developed from a SEM image of the Cu/20 vol % D composite sample. Several test cases were assumed with respect to the direction of heat flow and the boundary interactions between Cu/uncoated diamonds and Cu/Cr-coated diamonds. It was observed that the debonding behavior varied as a result of the differences in the coefficients of thermal expansions (CTEs) among Cu, diamond, and Cr. Moreover, the separation of interfaces had a direct influence upon the equivalent stress state of the Cu-matrix, since diamond particles only deformed elastically. It was revealed through a fully coupled thermo-mechanical FE analysis that repeated heating and cooling cycles resulted in an extremely high stress state within the Cu-matrix along the diamond interface. Since these stresses lead to interfacial debonding, their computation through numerical means may help in determining the service life of heat sinks for a given application beforehand.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2011 - Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles [Crossref]
  2. 2011 - Effect of coating on the microstructure and thermal conductivities of diamond-Cu composites prepared by powder metallurgy [Crossref]
  3. 2010 - Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles [Crossref]
  4. 2009 - Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials [Crossref]
  5. 2013 - Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder [Crossref]
  6. 2012 - Effect of molybdenum as interfacial element on the thermal conductivity of diamond/Cu composites [Crossref]
  7. 2014 - Optimization of sintering parameters for diamond-copper composites in conventional sintering and their thermal conductivity [Crossref]
  8. 2010 - Thermal properties of diamond-particle-dispersed Cu-matrix-composites fabricated by spark plasma sintering (SPS) [Crossref]
  9. 2013 - Preparation of copper-diamond composites with chromium carbide coatings on diamond particles for heat sink applications [Crossref]
  10. 2012 - High thermal conductivity composite of diamond particles with tungsten coating in a copper matrix for heat sink application [Crossref]

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