Application of amorphous diamond materials to provide a reliable, electrically insulating, thermal interface for IC devices for electronics applications in harsh environments
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2017-09-01 |
| Authors | Chris Walker, Eden T. Winlow |
| Citations | 1 |
Abstract
Section titled āAbstractāThe accelerated development of electronics is leading to an ever increasing heat output from high-power electronic parts. New materials are needed to manage this output, particularly in harsh environments. Diamond Like Carbon (DLC) is one of the most promising new groups of materials for these applications due to its properties of high thermal conductivity and electrical resistance. These coatings are of particular interest and are examined in this paper. Some of these coatings, such as those developed by Diamond Hard Surfaces Ltd, are particularly suitable for harsh environments due to their excellent adhesion. They have been found to have very high thermal conductivity in the range of 850-1050 Wm <sup xmlns:mml=āhttp://www.w3.org/1998/Math/MathMLā xmlns:xlink=āhttp://www.w3.org/1999/xlinkā>-1</sup> K <sup xmlns:mml=āhttp://www.w3.org/1998/Math/MathMLā xmlns:xlink=āhttp://www.w3.org/1999/xlinkā>-1</sup> and breakdown voltages in excess of 500V, even with a coating thickness of only 21Ī¼m. One successful implementation of these coatings as a heat spreader directly adhered to a heat sink is already in use, and maintains a resistance of 4.3 Ā± 0.4 MĪ© with a test voltage of500V. These coatings show promise as a future material of choice for thermal management and can be tailored to meet a range of specifications.