An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw

At a Glance

Metadata	Details
Publication Date	2017-10-03
Journal	Journal of Manufacturing Science and Engineering
Authors	Hui Huang, Xixi Li, Xipeng Xu
Institutions	Huaqiao University
Citations	28

Abstract

This study investigated the sawing of A-plane and C-plane sapphires using the reciprocating diamond wire saw. The influences of process parameters and sapphire crystal structure on sawing force were experimentally researched. The experimental results indicated that, in sapphire sawing process, the sapphire crystal structure, the wire speed, and the feed rate had effects on the tangential sawing forces, and the tangential forces had good linear relationships with the material removal rates (MRRs). The specific sawing energies in the stable stage were clearly smaller than in the unstable stage.

Tech Support

Original Source

DOI: https://doi.org/10.1115/1.4038109

References

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