An Innovative Light Trapping Structure Fabrication Method on Diamond‐Wire‐Sawing Multi‐Crystalline Silicon Wafers
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2018-07-09 |
| Journal | ChemistrySelect |
| Authors | Youbo Liu, Junna Zhang, Lei Wang, Hao Shen, Jie Chen |
| Institutions | State Key Laboratory of Silicon Materials, Zhejiang University |
| Citations | 4 |
Abstract
Section titled “Abstract”Abstract An innovative fabrication method of light trapping structures on the surface of diamond‐wire‐sawing multi‐crystalline silicon (DWS mc‐Si) is proposed, which may trigger new progress in photovoltaic (PV) industry. A simple pre‐etching step with HNO 3 /HF solution is used to remove the saw marks of the wafers as well as amorphous silicon layers, and form vermicular micro‐hollows. Then, the HNO 3 /HF fog formed by ultrasonic vibration etches the silicon surface to fabricate nano‐scale porous structures on the above microstructures. This micro‐nano composite structure (MNCS) surface shows low average light reflectivity (∼5.5%) and relatively higher effective minority carrier lifetime (∼5.2 μs). The innovative method is applied to fabricate the 156 mm × 156 mm DWS mc‐Si solar cells and the conversion efficiency of 18.01% has been obtained, which is 0.93% higher than the cells without MNCS. This method matches well with current PV industrial processes, which shows a promising prospect.