Laser recovery of grinding-induced subsurface damage in the edge and notch of a single-crystal silicon wafer
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2019-01-14 |
| Journal | Surface Topography Metrology and Properties |
| Authors | Keiichiro Niitsu, Yu Tayama, Takatoshi Kato, Jiwang Yan |
| Institutions | Keio University |
| Citations | 17 |
Abstract
Section titled āAbstractāThe edges and notches of silicon wafers are usually machined by diamond grinding, and the grinding-induced subsurface damage causes wafer breakage and particle contamination problems. However, the edge and notch surfaces have large curvature and sharp corners, thus it is difficult to be finished by chemo-mechanical polishing. In this study, a nanosecond pulsed Nd:YAG laser was used to irradiate the edge and notch of a boron-doped single-crystal silicon wafer to recover the grinding-induced subsurface damage. The reflection loss and the change of laser fluence when irradiating a curved surface were considered, and the damage recovery behavior was investigated. The surface roughness, crystallinity, and hardness of the laser recovered region were measured by using white light interferometry, laser micro-Raman spectroscopy, and nanoindentation, respectively. The results showed that after laser irradiation the damaged region was recovered to a single-crystal structure with nanometric surface roughness, and the surface hardness was also improved. This study demonstrates that laser recovery is a promising post-grinding process for improving the surface integrity of the edge and notch of silicon wafers.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2009 - Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining [Crossref]
- 2014 - On the cracks self-healing mechanism at ductile mode cutting of silicon [Crossref]
- 2017 - Analytical modeling of grinding-induced subsurface damage in monocrystalline silicon [Crossref]
- 2010 - Relationship between wafer edge design and its ultimate mechanical strength [Crossref]
- 2010 - Relationship between wafer fracture reduction and controlling during the edge manufacturing process [Crossref]
- 2009 - Investigation of the relationship between whole-wafer strength and control of its edge engineering [Crossref]
- 2008 - Grinding of silicon wafers: a review from historical perspectives [Crossref]
- 2007 - Response of machining-damaged single-crystalline silicon wafers to nanosecond pulsed laser irradiation [Crossref]
- 2009 - Recovery of microstructure and surface topography of grinding-damaged silicon wafers by nanosecond-pulsed laser irradiation [Crossref]