180 W Single-Mode Laser Operation of an Yb -YAG Thin Disk using a Robust Direct-Bonding Process
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2019-06-01 |
| Authors | LoĂŻc Deyra, Antoine Courjaud, Ramatou Bello, M. J. Milla, Johan Boullet |
| Institutions | ALPhANOV (France), Amplitude Systèmes (France) |
| Citations | 2 |
Abstract
Section titled âAbstractâSummary form only given. Over the last few years thin disks lasers have shown breakthrough records in both average power and peak power [1,2]. The optimization of the bonding process for mounting the laser disk to the base heat sink is key to achieving these impressive levels of performance. Processes using UV-adhesive bonding on diamond [1] or soldering [3] have regularly been reported. Direct-bonding is a promising solution to further improve the thermal contact between the disk and the substrate [3,4], but to the best of our knowledge this process has not been applied to thin disk lasers for high power, single mode operation. In this work, we characterize an Yb:YAG thin disk bonded on silicon carbide (SiC) using an adhesive-free, direct-bonding process developed by Crystalline Mirror Solutions (CMS). We employ this thin disk in a laser cavity to obtain 178 W of CW output power in a single TEM <sub xmlns:mml=âhttp://www.w3.org/1998/Math/MathMLâ xmlns:xlink=âhttp://www.w3.org/1999/xlinkâ>00</sub> mode beam.
Tech Support
Section titled âTech SupportâOriginal Source
Section titled âOriginal SourceâReferences
Section titled âReferencesâ- 2010 - Fabrication and Processing Technologies for Thin Disk Laser Elements