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6CCVD Research

Ultra-Thin Lightweight Bendable Crystalline Si Solar Cells for Solar Vehicles

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2019-06-01
AuthorsYoshio Ohshita, Yukio MIYASHITA, Atsushi Ogura, K. Onishi, Ryo Yokogawa
InstitutionsToyota Technological Institute, Nagaoka University of Technology
Citations3

Abstract

Section titled ā€œAbstractā€

Komatsu NTC developed ultra-thin wafer slicing with low kerf-loss by multi diamond-wire saw. We modified slicing conditions and diamond-wire specifications to keep the straightness of wire for the fine pitch slicing and established 150 Ī¼m pitch slicing technology. The as-cut wafer thickness is 90 Ī¼m, and the kerf-loss is 60 Ī¼m. As a result, the highly flexible ultrathin wafer can be obtained with well-controlled surface crystallinity. The PERT cell fabrication trial using ultra-thin wafers showed that the relative deference of cell efficiency between 166 Ī¼m thick and 84 Ī¼m thick solar cells was just only 1.2%.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2015 - Novel Silver and Copper Pastes for N-type Bi-facial PERT Cell

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