Multi-Parameters Optimization for Diamond Microchannel Heat Sink
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2019-08-01 |
| Authors | Weihao Li, Longguang Zhu, Feng Ji, Jinling Yu, Yufeng Jin |
| Institutions | Fuzhou University |
| Citations | 6 |
Abstract
Section titled āAbstractāWith semiconductor processes advancing, integrated circuits have moved further along the Mooreās Law [1]. Meanwhile, chip integration and power density increased substantially, making thermal problems more serious [2]. In this circumstance, researchers have conducted a large number of experiments on fluid flow and heat transfer in microchannels, to improve cooling performance. In the early days, microchannel heat dissipation technique was mostly achieved by etching microchannels on silicon wafers. There is no doubt that diamond has a thermal conductivity one magnitude higher than silicon. So diamond can improve the heat dissipation performance of the heat sink. Due to diamond etching technology has been developed, the use of diamond as a material for heat sinks has received extensive attention. In this paper, finite element simulation is used to study thermal property of diamond heat sink. The microchannel heat sink is fabricated by bonding a diamond wafer and a silicon wafer. Temperature rise is the objective function to be minimized with height of microchannels (H <sub xmlns:mml=āhttp://www.w3.org/1998/Math/MathMLā xmlns:xlink=āhttp://www.w3.org/1999/xlinkā>c</sub> ), number of microchannels (N), and the duty ratio of microchannel (Ī±), as optimize variables. Depending on the experimental results, combined with the actual feasibility, the best result is that the flow path height is 250 Ī¼m, the duty ratio is 0.7, and the number of flow channels is 60. Under this condition, the temperature rise is 30Ā°C.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 0 - More-than-Moore white paper[J]