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6CCVD Research

Optimizing the Process of Multi-wire Sawing Silicon Rods with Consolidated Abrasive Diamonds Based on RSM

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2019-11-01
JournalIOP Conference Series Materials Science and Engineering
AuthorsChaohua Wu, Wang Ye, Ming Guo, Shun Liu, Jiangjing Lin
InstitutionsWuhan Ship Development & Design Institute, Wuhan University of Technology

Abstract

Section titled ā€œAbstractā€

Abstract In order to improve the processing efficiency and processing quality of silicon rods, and to optimize the process parameters during the cutting process of silicon rods, the sawing force of wire saw is studied from the aspects of cutting deformation and friction. Meanwhile, the mathematic model is established between the sawing force and some cutting process parameters. Besides, the quadratic regression model is also established by Box-Behnken center combination experiment and the response surface methodology(RSM), which can reflect the wire saw speed, workpiece feed rate and wire saw radius of the interaction of three process parameters on the wire saw sawing force. The results show that the model can accurately predict the sawing force and optimize the process parameters during the cutting process as well.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

References

Section titled ā€œReferencesā€
  1. 2010 - The research of fixed abrasive diamond wire saw technology
  2. 2017 - Finite element analysis of multi-wire saw silicon rods with consolidated abrasive diamonds [Crossref]
  3. 2016 - Modeling and analysis of the grit level interaction in diamond wire sawing of silicon
  4. 2015 - Analysis and modeling cutting force for SiC monocrystal wafer processing [Crossref]
  5. 2008 - Research on sawing forces during ultrasonic vibration cutting of hard and brittle materials with electroplated diamond wire saw
  6. 2014 - Modeling and prediction for cutting force in SiC monocrystal wafers processing process
  7. 2005 - Study on Random Vibration of Electroplate Diamond Wire Saw Subjected to Sawing Force
  8. 2009 - Study on the machining performance of single crystal silicon wafer cut by using reciprocating electroplated diamond wire saw
  9. 2014 - Situation and development of fixed diamond abrasive wire cutting technology
  10. 2016 - Experimental Research on Monocrystalline Si High-speed Wire Sawing Force Based on RSM

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