Physical and mechanical properties and structure of copper-based composite materials for diamond tools binder
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2020-01-01 |
| Journal | Journal of Physics Conference Series |
| Authors | Valentin Smirnov, E P Shalunov, Ivan Golyushov |
| Institutions | Chuvash State University |
| Citations | 5 |
Abstract
Section titled āAbstractāAbstract The article describes the structure and physical and mechanical properties of dispersion-strengthened composite materials of Cu-Al-Ti-Sn-C-O system developed as a binder for making diamond tools for grinding composite materials and, in particular, hard alloys. It is shown that the materials under analysis have high thermal conductivity and recrystallization temperature values and are not inferior by mechanical properties to Cu-Sn system binders and, in particular, Cu-20 Sn binder widely used in the industry.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
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