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The design and performance of hydrogen-terminated diamond metal-oxide-semiconductor field-effect transistors with high k oxide HfO2

MetadataDetails
Publication Date2020-01-08
JournalMicro and Nano Engineering
AuthorsChi Sun, Tingting Hao, Junjie Li, Haitao Ye, Changzhi Gu
InstitutionsUniversity of Chinese Academy of Sciences, Songshan Lake Materials Laboratory
Citations10

The hydrogen plasma treatment of single crystal diamond was carried out by microwave plasma chemical vapor deposition equipment, and the normally-off hydrogen-terminated diamond field-effect transistors (FETs) with different gate lengths were prepared by atomic layer deposition (ALD) which deposited HfO2 as gate oxide. We systematically investigated the influence of hydrogen treatment duration, gate length, channel length and gate oxide material HfO2 on the hydrogen-terminated diamond FETs. Results show that the HfO2 gate oxide allows the fabricated FETs to exhibit a normally-off characteristic, which is advantageous for the practical application of power devices. The drain-source current, threshold voltage, subthreshold swing, and Ion/Ioff of the fabricated diamond FETs with gate length of 5 μm are 11 mA/mm, āˆ’2.9 V, 3 mS/mm, and 106, respectively. With the increase of the gate length (Lg = 5 μm, 20 μm, 50 μm), the drain current density, threshold voltage, and transconductance of the devices decrease, which is due to the higher channel resistance and inhomogeneity of the hydrogen surface termination. Keywords: H-diamond, MOSFET, high-k, Normally-off

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