Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2020-03-24 |
| Authors | Alexander Sewergin, Martin Rittner, Andreas Burghardt, Kai Kriegel, G. MitiÄ |
Abstract
Section titled āAbstractāThis paper introduces a new switching cell design approach. While state-of-the-art power modules utilize bond wires and DBC-substrate, the proposed switching cell design focuses upon the elimination of bond wires in the power-loop by using a high temperature co-fired ceramics (HTCC) board. Moreover, the coefficients of thermal expansion (CTE) of the SiC-MOSFETs and the copper heat-sink are adapted through integrated copper-diamond (Cu-C) buffer layers.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal Sourceā- DOI: None