Cooling mechanism for high performance device analysis
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2020-07-20 |
| Authors | Hirotaka Nonaka, Hirotoshi Terada, Tomonori Nakamura, Hiroyuki Matsuura, Akihiro Nakamura |
| Institutions | Hamamatsu Photonics (Japan) |
Abstract
Section titled āAbstractāPerforming optical failure analysis on high power consumption devices (e.gs. gaming GPUs, server chips) traditionally has many limitations. Some failures occur only at full speed meaning both high resolution imaging and active cooling must take place at the same time. Diamond cooling windows have high heat dissipation [1], but may require complete physical contact with all device hot spots during test to avoid thermal runaway. Water cooling solutions can overcome the physical contact problem, but present the issue of needing to protect lenses and turrets from the water coolant. Water containment solutions can place limitations on the number of lenses and magnifications available for imaging. This paper describes a novel, highly contained water cooling solution that has achieved 200 watt DUT power dissipation while allowing for both SIL and flexible 10-lens turret imaging.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2019 - Advanced Fault Isolation Technologies: Design House and Foundry Perspectives
- 2004 - Spray Cooling for Time Resolved Measurements of ICs
- 2013 - Laser Induced Techniques for Microelectronic Failure Analysis:SDL and LADA