Effect of Microstructures With Different Depth-to-Width Ratios on Surface Reflectance and Si Solar Cell Performance
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2020-07-01 |
| Journal | IEEE Journal of Photovoltaics |
| Authors | Xiaowei Wu, Yi Tan, Jiayan Li, Min Cai, Pengting Li |
| Institutions | Dalian University of Technology |
| Citations | 2 |
Abstract
Section titled “Abstract”Metal-catalyzed chemical etching (MCCE) is an effective method for making texture surface on diamond wire saw (DWS) cut mc-Si wafer. In this work, microstructures with different depth-to-width ratios were obtained by MCCE on the surface of DWS cut mc-Si wafers. Simultaneously, the influence of etching time and the concentration of AgNO <sub xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>3</sub> on etching depth, surface reflectance performance, and effect of reaming on the solar cell performance were studied. In total, 12 microstructures with different depth-to-width ratios ranging from 0.63 to 5.31 were prepared. The etching rate increased with the increase in concentration of AgNO <sub xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>3</sub> and etching time. Moreover, the depth-to-width ratio significantly affected the reflectivity of silicon wafers. The relationship between them can be expressed by the fitting exponential function: y = 12.41 × x <sup xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”>-0.733</sup> . The reflectivity obtained in the experiment ranged from 3.71% to 18.15%. After reaming, the performance of the mc-Si solar cells has been significantly improved, and η could reach up to 18.53%.
Tech Support
Section titled “Tech Support”Original Source
Section titled “Original Source”References
Section titled “References”- 2017 - Rapid optical modelling of plasma textured silicon