Study on the effects of different types and concentrations of copper salts on the texturing of p-type single crystal silicon
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2025-05-01 |
| Journal | Journal of Physics Conference Series |
| Authors | Yuxin Zou, Huan Liu, Ting Yang, XiaoâJuan Yang |
Abstract
Section titled âAbstractâAbstract Using diamond wire sawing P-type single crystal silicon as raw material, the study examines the effects of different types and concentrations of copper salts on texturing the surface of silicon wafers. The research results indicate that under three different copper salt etching systems, the controlled preparation of various structures such as grid-like, porous, and inverted pyramid on the silicon wafer surface is achievable. The etched morphologies on the silicon wafer surface are primarily due to the combined effects of the oxidizing nature and complexing ability of the anions in the copper salts, as well as the interaction forces between the cations and anions affecting the deposition of copper nanoparticles on the silicon surface. This theoretical research can lay the foundation for the texturing of high-efficiency silicon solar cells.
Tech Support
Section titled âTech SupportâOriginal Source
Section titled âOriginal SourceâReferences
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