Research Status and Prospect on Polishing Technology of Large Size Single Crystal Diamond Substrate
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2021-01-01 |
| Journal | Journal of Mechanical Engineering |
| Authors | 单晶金刚石在生长技术和半导体掺杂技术上的进展 一直以来, 成熟的衬底加工技术是半导体材料得以应用的基础, 其中超, 精密抛光作为晶圆衬底加工的最后一道工序 直接决定了晶圆表面粗糙度和亚表面损伤程度, 。 可以预见 |
| Institutions | Huaqiao University |
| Citations | 3 |
Abstract
Section titled “Abstract”Abstract：In recent years, the application of chemical vapor deposition(CVD) single crystal diamond in the field of electronics has attracted attention, thanks to the progress of CVD single crystal diamond in growth technology and semiconductor doping technology.All along, the mature substrate processing technology is the basis for the application of semiconductor materials.Among them, ultra-precision polishing is the final process of wafer substrate processing, which directly determines the surface roughness and subsurface damage.It is foreseeable that the ultra-precision polishing plays an important role in the fabrication of high-quality diamond substrate.The polishing methods of single-crystal diamond at home and abroad in recent years are reviewed, with the goal of preparing large-sized and high-quality single-crystal diamond substrates, and analyzes from the aspects of processing equipment, process parameters, processing accuracy, processing efficiency and material removal mechanism.The advantages and disadvantages of various polishing methods are summarized, and the future development trend of polishing technology for large-size single crystal diamond substrates is prospected.At present, there are few surveys on the polishing technology of large-size single crystal diamond.Reference materials for domestic scholars are provided to carry out research on single crystal diamond polishing.