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Preparation of boron-doped diamond attenuator for W-band folded waveguide traveling wave tube

MetadataDetails
Publication Date2021-04-27
Journal2021 22nd International Vacuum Electronics Conference (IVEC)
AuthorsChenyi Hua, Lili Li, Pan Pan, Jun Cai, Jinjun Feng
Citations1

Attenuators with high thermal conductivity and high fracture strength were required in vacuum electronic devices. In this work, boron-doped diamond film which was used as microwave attenuation material was prepared by DC arc jet chemical vapor deposition (CVD) and the boron-doped diamond attenuator for W-band fold waveguide traveling wave tube (TWT) was fabricated based on simulation results. The results showed that the dielectric constant of boron-doped diamond film was between 7.49 and 8.43, and the loss tangent was around 0.32 in W-band. Meanwhile, the fracture strength of boron doped diamond was 428±22 MPa in average. In addition, the voltage standing wave ration (VSWR) and S <inf xmlns:mml=ā€œhttp://www.w3.org/1998/Math/MathMLā€ xmlns:xlink=ā€œhttp://www.w3.org/1999/xlinkā€&gt;21&lt;/inf> of boron doped CVD diamond attenuator were less than 1.10 and below āˆ’50 dB in the range of 85-110 GHz.

  1. 2006 - broadband microwave and W-band characterization of BeO-SiC and AlN-based lossy dielectric composites for vacuum electronics
  2. 2008 - attenuator for W-band folded waveguide TWT