Fabrication of PCD Skiving Cutter by UV Nanosecond Laser
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2021-07-19 |
| Journal | Materials |
| Authors | Jianlei Cui, Xuyang Fang, Xiangyang Dong, Xuesong Mei, KaiâDa Xu |
| Institutions | Xiâan Jiaotong University |
| Citations | 12 |
| Analysis | Full AI Review Included |
Executive Summary
Section titled âExecutive SummaryâThis research details the development and optimization of a two-step UV nanosecond laser process for fabricating high-quality Polycrystalline Diamond (PCD) skiving cutters.
- Core Innovation: A two-step laser machining strategy combining roughing (orthogonal irradiation) for bulk removal and finishing (tangential irradiation) for high-accuracy edge refinement.
- Laser Selection: Finite Element Analysis proved the UV nanosecond laser (355 nm) superior to femtosecond (FSL) and picosecond (PSL) lasers, achieving material removal primarily through photochemical etching rather than thermal ablation.
- Thermal Damage Mitigation: The UV nanosecond laser produced a thinner graphite layer (sp2 carbon) compared to FSL and PSL, indicating reduced thermal damage during processing.
- Contour Accuracy Optimization: Systematic variation of roughing parameters (line interval, scanning speed, defocusing amount) was performed to minimize the contour accuracy deviation (Rt).
- Optimal Result: A superior PCD skiving cutter was achieved with a final contour accuracy (Rt) of 5.6 ”m.
- Phase Integrity: Raman spectroscopy confirmed that the finished cutting face maintained strong sp3 bonds (diamond phase) with no detectable graphite phase transition damage.
Technical Specifications
Section titled âTechnical Specificationsâ| Parameter | Value | Unit | Context |
|---|---|---|---|
| Laser Type | UV Nanosecond | N/A | INNO-FOTIA-355-OEM-2 |
| Wavelength | 355 | nm | Input Laser Parameter |
| Pulse Width | 10 | ns | Input Laser Parameter |
| Pulse Repetition Rate (Fixed) | 50 | kHz | Used for maximum average power |
| Focal Spot Diameter | 20 | ”m | Input Laser Parameter |
| Optimal Line Interval (Roughing) | 3 | ”m | Parameter for minimum Rt |
| Optimal Defocus Amount (Roughing) | 100 | ”m | Positive defocus for minimum Rt |
| Optimal Scanning Speed (Roughing) | 400 | mm/s | Parameter for minimum Rt |
| Final Contour Accuracy (Rt) | 5.6 | ”m | Achieved on finished PCD cutter |
| Diamond Phase Peak (Raman) | 1335 | cm-1 | sp3 hybrid structure |
| Graphitization Temperature | 1233 | K | Diamond to graphite transition point |
| Graphite Gasification Temperature | 4827 | K | Material removal point in simulation |
Key Methodologies
Section titled âKey MethodologiesâThe fabrication process utilized a two-step laser machining approach combined with simulation and characterization:
- Laser System Configuration: A UV nanosecond laser (355 nm) was integrated with a galvo scanner and a 4-axis Computer Numerical Control (CNC) motion platform (XYZ linear and C rotary axis) to control the beam path and sample positioning.
- Roughing Machining (Orthogonal Exposure):
- The laser beam transmission direction was vertical (orthogonal) to the horizontal processing plane.
- The beam scanned in an S-shape path along the tool contour to quickly remove bulk material and establish the basic gear shape.
- Processing parameters (line interval, scanning speed, defocusing amount) were optimized to minimize the contour accuracy (Rt) before finishing.
- Finishing Machining (Tangential Exposure):
- The laser beam remained vertical, but the axial trajectory was consistent with the contour of the machined outer edge.
- The small outer part of the laser beam was used to etch the PCD material tangentially, polishing the flank face and repairing the cutting edge shape.
- Finite Element Simulation (FEA):
- A 2D solid heat transfer model (Comsol Multiphysics) was established to compare the ablation and temperature distribution of FSL (1064 nm), PSL (532 nm), and NSL (355 nm).
- The simulation focused on the degree of graphitization (material temperature between 1233 K and 4827 K) to validate the UV laserâs photochemical mechanism.
- Surface Characterization:
- Scanning Electron Microscopy (SEM) was used to observe the cutting edge morphology and defects under various roughing parameters.
- Raman Spectroscopy was applied to the processed surfaces (orthogonal, tangential, main flank face) to confirm the absence of sp2 (graphite) phase transition damage.
Commercial Applications
Section titled âCommercial ApplicationsâThis UV nanosecond laser fabrication technology is critical for industries requiring high-precision tools made from ultra-hard materials:
- Precision Gear Manufacturing: Direct application in fabricating high-accuracy PCD skiving cutters, enabling the production of high-precision gears with superior efficiency and quality.
- Aerospace and Defense: Manufacturing of miniature, high-reliability mechanical components where stringent shape accuracy and surface integrity standards are required.
- Advanced Tooling and Machining: Production of specialized PCD cutting tool inserts that require extremely sharp, defect-free blades, leveraging the non-contact, low-damage nature of UV laser processing.
- Micro-Machining of Hard Materials: General application in processing other ultra-hard materials (e.g., ceramics, composites) where minimizing thermal damage and achieving sub-micron tolerances are essential.
- Electronics and Semiconductor Tooling: Fabrication of precision tools used in handling or cutting fragile, hard materials common in electronics manufacturing.
View Original Abstract
Polycrystalline diamond (PCD) skiving cutter has dominated research in recent years. However, the traditional methods of fabrication have failed to cut the diamond with high quality. We propose the two-step laser machining process combining roughing machining with orthogonal irradiation and finishing machining with tangential irradiation. In addition, the processing effect and mechanism of different lasers on the diamond were investigated by a finite element analysis. Itâs proved that the ultraviolet nanosecond laser is an excellent machining method for the processing of diamond. Furthermore, the effect of the processing parameters on the contour accuracy (Rt) was studied. The result indicates that the Rt value decreases first and then increases as the increase of the line interval, scanning speed and defocusing amount (no matter positive or negative defocus). Further, Raman spectroscopy was applied to characterize the diamond surface under different cutting methods and the flank face of the tool after processing. Finally, a high-quality PCD skiving cutter was obtained with an Rt of 5.6 ”m and no phase transition damage.
Tech Support
Section titled âTech SupportâOriginal Source
Section titled âOriginal SourceâReferences
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