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Effects of the sequential implantation of Mg and N ions into GaN for p-type doping

MetadataDetails
Publication Date2021-09-29
JournalApplied Physics Express
AuthorsHideki Sakurai, Tetsuo Narita, Keita Kataoka, Kazufumi Hirukawa, Kensuke Sumida
InstitutionsToyota Central Research and Development Laboratories (Japan), Polish Academy of Sciences
Citations32

The sequential implantation of Mg and N ions into GaN was investigated using conventional rapid thermal annealing and ultra-high-pressure annealing (UHPA). In cathodoluminescence, the green luminescence related to nitrogen vacancies (VNs) was mostly suppressed at the Mg/N ratio of 0.5-1.0, whereas the donor-acceptor pair (DAP) emission as a signature of Mg acceptors was maintained high. The excess N implantation reduced the DAP emission through the formation of nonradiative recombination centers. The combined process of optimal Mg/N implantation and UHPA at 1673 K improved ohmic contacts by increasing Mg concentration and suppressing VNs near the surface.