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6CCVD Research

Laminated wafer with the conductive diamond layer using surface activated bonding at room temperature for micro-electro mechanical systems sensors

At a Glance

Section titled ā€œAt a Glanceā€
MetadataDetails
Publication Date2021-10-05
AuthorsYoshihiro Koga, Shunsuke Yamada, Shuji Tanaka, Kazunari Kurita
InstitutionsTohoku University, Sumco Corporation (Japan)

Abstract

Section titled ā€œAbstractā€

We proposed the fabrication of the laminated wafer with the conductive diamond layer as an alternative SOI wafer for micro-electro mechanical systems (MEMS) sensors by chemical vapor deposition (CVD) and surface-activated bonding (SAB), in order to prevent the charge-up of devices on a BOX layer during plasma treatments. We demonstrated that the use of this laminated wafer could be deposited the boron-doped diamond layer and be bonded a silicon wafer (layer) at room temperature without a thermal stress. Therefore, we believe that this laminated wafer can contribute to the improvement of MEMS sensors as an alternative SOI wafer.

Tech Support

Section titled ā€œTech Supportā€

Original Source

Section titled ā€œOriginal Sourceā€

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