Skip to content

Fabrication and Characterization of GaN/Diamond bonding interface

MetadataDetails
Publication Date2021-10-05
AuthorsAyaka Kobayashi, Yasuo Shimizu, Yutaka Ohno, S. W. Kim, Koichi Koyama
InstitutionsSaga University, Osaka City University

Direct bonding of diamond and GaN is successfully fabricated by surface activated bonding method. An 80% contact area of diamond and GaN is obtained. The effect of annealing temperature on the structure properties of the bonding interface is investigated under in-situ annealing in a transmission electron microscope (TEM).