Fabrication and Characterization of GaN/Diamond bonding interface
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2021-10-05 |
| Authors | Ayaka Kobayashi, Yasuo Shimizu, Yutaka Ohno, S. W. Kim, Koichi Koyama |
| Institutions | Saga University, Osaka City University |
Abstract
Section titled āAbstractāDirect bonding of diamond and GaN is successfully fabricated by surface activated bonding method. An 80% contact area of diamond and GaN is obtained. The effect of annealing temperature on the structure properties of the bonding interface is investigated under in-situ annealing in a transmission electron microscope (TEM).