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An enhanced two-dimensional hole gas (2DHG) C–H diamond with positive surface charge model for advanced normally-off MOSFET devices

MetadataDetails
Publication Date2022-03-10
JournalScientific Reports
AuthorsReem Alhasani, Taichi Yabe, Yutaro Iyama, Nobutaka Oi, Shoichiro Imanishi
InstitutionsWaseda University
Citations19
AnalysisFull AI Review Included

This research successfully models and validates the normally-off (enhancement mode) operation of a p-channel C-H diamond MOSFET, a critical requirement for safe power electronic devices, using a fixed positive interface charge sheet model.

  • Core Achievement: Demonstrated normally-off operation (Vth = -3.5 V) in a C-H diamond MOSFET, overcoming the typical normally-on behavior associated with the two-dimensional hole gas (2DHG) layer.
  • Mechanism: The normally-off state is achieved by introducing a fixed positive interface charge (Qf = 1 x 1011 cm-2) at the Al2O3/C-H diamond interface, which prevents hole accumulation and channel formation at zero gate voltage.
  • Doping Strategy: Deep donor nitrogen (N) doping (1.7 eV from the conduction band minimum) in the diamond bulk pins the Fermi level, enabling the necessary band bending for inversion channel control.
  • Performance Metrics: The simulated maximum drain current density (IDS Max) reached -290 mA/mm, closely matching the experimental result of -305.0 mA/mm obtained using an Al2O3/SiO2 gate stack.
  • Device Feasibility: The device exhibited a high breakdown voltage of 1275 V (for a 20 µm gate-drain distance), confirming its suitability for high-power applications.
  • Modeling Tool: The characteristics were analyzed using the two-dimensional Silvaco Atlas TCAD simulator employing the drift-diffusion model and incomplete ionization model for impurities.
ParameterValueUnitContext
Maximum Drain Current Density (Simulated)-290mA/mmPositive charge model, VGS = -40 V, VDS = -30 V
Maximum Drain Current Density (Experimental)-305.0mA/mmAl2O3/SiO2/C-H Diamond, VGS = -40 V
Threshold Voltage (Vth)-3.5VSimulated normally-off operation (Enhancement mode)
Transconductance (gm)0.4mS/mmSimulated, VDS = -0.5 V
Breakdown Voltage (Experimental)1275VDevice with LGD = 20 µm
Fixed Positive Interface Charge (Qf)1 x 1011cm-2Required density for normally-off simulation
Nitrogen (Donor) Concentration (ND)2 x 1016cm-3Substrate doping concentration
Boron (Acceptor) Concentration (NA)2 x 1015cm-3Substrate doping concentration
Nitrogen Donor Level (ED)1.7eVFixed Fermi level position from Conduction Band Minimum (CBM)
Diamond Bandgap (Eg)5.5eVMaterial property
Electron Affinity (EA)-1.3eVC-H diamond surface property
Hole Mobility (Surface)100cm2/VsParameter used in modeling
Gate Oxide Thickness (tox)200nmALD-Al2O3 layer
Channel Length (LCH)4µmSimulated device dimension

The device operation was analyzed using a combination of experimental fabrication and two-dimensional (2D) device simulation (Silvaco Atlas TCAD).

  1. Device Structure Modeling:

    • Modeled a C-H diamond MOSFET structure with a 4 µm thick diamond substrate.
    • Gate stack consisted of 200 nm ALD-Al2O3 (simulated) or 2 nm SiO2 under Al2O3 (experimental).
    • Source/Drain contacts were modeled as ideal Schottky contacts (SBH of 0.1 eV) using Au/Ti.
  2. Doping and Fermi Level Pinning:

    • Substrate was doped with low Boron (acceptor, 2 x 1015 cm-3) and higher Nitrogen (donor, 2 x 1016 cm-3).
    • The deep donor level of Nitrogen (1.7 eV from CBM) was used to fix the Fermi level position in the bulk, which is necessary for controlling the inversion channel.
  3. Interface Charge Modeling:

    • Three fixed interface charge sheet models were investigated: Negative (normally-on), Neutral (Vth = 0 V), and Positive (normally-off).
    • The positive charge model (Qf = 1 x 1011 cm-2) was selected to reproduce the normally-off operation observed experimentally.
  4. Simulation Physics:

    • The 2D drift-diffusion model was used for carrier transport analysis.
    • The incomplete ionization model for impurities was applied, recognizing that nitrogen in diamond is hard to ionize (deep donor).
    • Poisson’s equation was used to define the space charge based on the electrostatic potential and charge density (including mobile and fixed charges).
  5. Experimental Validation:

    • 2DHG diamond MOSFETs were fabricated using a thin SiO2 layer (2 nm) under the gate to introduce positive charge effects.
    • Experimental IDS-VDS and Vth distributions confirmed that the SiO2 layer successfully induced normally-off operation (Vth = -3.5 V), validating the positive interface charge model used in the simulation.

The development of high-performance, normally-off p-channel diamond MOSFETs addresses critical needs in high-power electronics where safety and efficiency are paramount.

  • Power Electronics and Inverter Systems: Diamond’s wide bandgap (5.5 eV) and high thermal conductivity (22 W/cmK) make it ideal for high-power FETs, enabling low switching losses and high efficiency in inverter systems.
  • High Breakdown Voltage Devices: The demonstrated 1275 V breakdown voltage supports applications requiring robust, high-voltage switching capabilities.
  • Complementary Power MOSFETs (CMOS): The successful realization of a normally-off p-channel device is essential for developing diamond-based complementary power MOSFETs, potentially using vertical FETs or trench gates.
  • High-Frequency Devices: Diamond’s high carrier mobility (4500 cm2/Vs for electrons, 3800 cm2/Vs for holes) supports high-frequency operation in RF power amplifiers and switching circuits.
  • Smart Inverter Systems: Enabling low on-resistance and high toughness for next-generation smart grid and electric vehicle (EV) power management systems.