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875-MW/cm² Low-Resistance NO₂ p-Type Doped Chemical Mechanical Planarized Diamond MOSFETs

MetadataDetails
Publication Date2022-04-04
JournalIEEE Electron Device Letters
AuthorsNiloy Chandra Saha, Seong‐Woo Kim, Toshiyuki Oishi, Makoto Kasu
InstitutionsSaga University
Citations26

In this study, an Al <sub xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”&gt;2&lt;/sub> O <sub xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”&gt;3&lt;/sub> passivated, NO <sub xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”&gt;2&lt;/sub> p-type doped diamond metal-oxide-semiconductor field-effect transistor (MOSFET) was fabricated on a chemical mechanical planarized high-quality heteroepitaxial diamond (Kenzan diamond <sup xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”&gt;®&lt;/sup> ) substrate. This MOSFET exhibited a low specific ON-resistance of 7.54 <inline-formula xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”> <tex-math notation=“LaTeX”>$\text{m}\Omega \cdot $ </tex-math></inline-formula> cm <sup xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”&gt;2&lt;/sup> and a high OFF-state breakdown voltage of −2568 V. The chemical mechanical planarization (CMP) was performed for 200 h on the diamond surface which effectively removed the subsurface damages resulting in a low resistive diamond surface. Thus, the MOSFET showed a high drain current density of −0.68 A/mm and a maximum available power density (Baliga’s figure-of-merit) of 874.6 MW/cm <sup xmlns:mml=“http://www.w3.org/1998/Math/MathML” xmlns:xlink=“http://www.w3.org/1999/xlink”&gt;2&lt;/sup> —the highest reported value for diamond devices.